Our flagship product, InductEx, supports multiple powerful 3D solver engines (using cuboid or tetrahedral mesh elements) and parameter sweep capabilities. It includes critical field calculation for flux trapping locations, external magnetic field analysis, the calculation of coupling from holes in superconducting planes to circuit structures, capacitance extraction with multiple dielectric layers, characteristic impedance extraction and support for permeable materials. Compact SPICE model extraction in the EM environment is supported. InductEx also supports packaging analysis with highly customizable wire bonds and other interconnects.

InductEx is split into various tiers based on user requirements.